ACAS 0612 - Professional

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Vishay Beyschlag

Revision: 13-Dec-12

6

Document Number: 28754

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TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with the

following specifications:

EN 60115-1, generic specification

EN 140400, sectional specification

EN 140401-801, detail specification

The testing also covers most of the requirements specified

by EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068 (1)

and under standard atmospheric conditions according to

IEC 60068-1 (1)

, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower category temperature, upper

category temperature; damp heat, long term, 56 days) is

valid (LCT = - 55 °C/UCT = 125 °C).

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

The requirements stated in the “Test Procedures and

Requirements” table are based on the required tests and

permitted limits of EN 140401-801 where applicable.

Notes

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.

(2) Figures are given for arrays with equal values, design type AE.

(3) For a single element.

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

60068-2 (1)

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (2)

(

R)

Stability for product types:

ACAS 0612

47

 to 221 k

4.5

-

Resistance

-

± 1 %; ± 0.5 %

4.8.4.2

-

Temperature coefficient

At (20/- 55/20) °C and

(20/125/20) °C

± 50 ppm/K; ± 25 ppm/K

4.25.1

-

Endurance

U =

or U = Umax.;

1.5 h on; 0.5 h off;

whichever is the less severe;

70 °C; 1000 h

± (0.25 % R + 0.05

)

4.25.3

-

Endurance at upper

category temperature

125 °C; 1000 h

± (0.25 % R + 0.05

)

4.24

78 (Cab)

Damp heat,

steady state

(40 ± 2) °C; 56 days;

(93 ± 3) % RH

± (0.5 % R + 0.05

)

4.13

-

Short time overload (3)

U = 2.5 x

or

U = 2 x Umax.; 5 s

± (0.1 % R + 0.01

)

no visible damage

4.19

14 (Na)

Rapid change of

temperature

30 min at - 55 °C and

30 min at 125 °C;

5cycles

± (0.1 % R + 0.01

)

no visible damage

4.18.2

58 (Td)

Resistance to soldering

heat

Reflow method 2

(IR/forced gas convection);

(260 ± 5) °C; (10 ± 1) s

± (0.25 % R + 0.01

)

no visible damage

4.17.2

58 (Td)

Solderability

Solder bath method;

SnPb; non-activated flux

accelerated ageing 4 h/155 °C

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (

 95 % covered);

no visible damage

Solder bath method;

SnAgCu; non-activated flux

accelerated ageing 4 h/155 °C

(235 ± 3) °C; (2 ± 0.2) s

4.32

21 (Ue3)

Shear (adhesion)

45 N

No visible damage

4.33

21 (Ue1)

Substrate bending

Depth 2 mm, 3 times

± (0.1 % R + 0.01

)

no visible damage;

no open circuit in bent position

4.7

-

Voltage proof

URMS = Uins

(60 ± 5) s; against ambient,

between adjacent resistors

No flashover or breakdown

P

70 x R

P

70 x R