BCR

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Vishay Electro-Films

Revision: 26-Oct-2020

2

Document Number: 61023

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DIMENSIONS in inches

Note

• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip size

0.020" x 0.020" ± 0.002" (0.50 mm x 0.50 mm ± 0.05 mm)

Chip thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip substrate material

Oxidized silicon, 10 kÅ minimum SiO2

Resistor material

Tantalum nitride, self-passivating

Bonding pad size

0.004" x 0.004" (0.100 mm x 0.100 mm)

Number of pads

1

Pad material

10 kÅ minimum aluminum (15 kÅ minimum gold optional)

Backing

3 kÅ minimum gold

Recommended attachment method

Eutectic or conductive epoxy

GLOBAL PART NUMBER INFORMATION

Global Part Number: BCR50000FKAHWS



Global Part Number Description: BCR 5K 1 %, 100 ppm/°C, Al term., Class H, WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

TCR

(ppm/°C)

TERMINATION

VISUAL CLASS

(per MIL-STD-883,

method 2032)

PACKAGING

BCR

20 x 20 size

back contact

resistor

First 4 digits

are significant

figures of

resistance

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1 %

C = 0.25 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

J = 5.0 %

K = 10 %

E = ± 25

C = ± 50

K = ± 100

M = ± 250

R = 0 / - 250

G = gold

A = aluminum

H = class H

K = class K

WS = waffle pack

100 min./mult.

TYPICAL RANGE

10

Ω to 29 Ω

0.016

0.020

0.020

TYPICAL RANGE

30

Ω to 81 Ω

TYPICAL RANGE

82

Ω to 819 Ω

TYPICAL RANGE

820

Ω to 1 MΩ

Bond Pad

Back of Chip

50

00

F

K

A

0

R

H

BC

W

S