CLA, CLB

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Vishay Electro-Films

Revision: 30-May-2022

2

Document Number: 61009

For technical questions, contact: efi@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS in inches

CLA 8 Cell

CLB 8 Cell

0.090

0.060

0.054

0.007

0.004

0.004

0.090

0.060

0.054

0.0775

0.004

0.004

0.007

DIMENSIONS in inches

# OF RES.

03

04

06

08

12

CLA

0.060 x 0.060 ± 0.003 0.050 x 0.060 ± 0.003 0.069 x 0.060 ± 0.003 0.090 x 0.060 ± 0.003 0.130 x 0.060 ± 0.003

CLB

0.060 x 0.060 ± 0.003 0.050 x 0.060 ± 0.003 0.069 x 0.060 ± 0.003 0.090 x 0.060 ± 0.003 0.130 x 0.060 ± 0.003

MECHANICAL SPECIFICATIONS

PARAMETER

Chip Size

See Dimensions table above

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Oxidized silicon, 10 kÅ minimum SiO2

Resistor Material

Tantalum nitride, self-passivating

Bonding Pads

0.004" x 0.007" (0.10 mm x 0.178 mm)

Number of Top Pads

CLA - 16

CLB - 9

Pad Material

10 kÅ minimum aluminum

Backing

None, lapped semiconductor silicon

GLOBAL PART NUMBER INFORMATION

Global Part Number: CLA0830000FFKANHWS

Global Part Number Description: CLA 8 Res 3K 1 %, 100 ppm/°C, Al terminations, no back metal, class H WS

MODEL

TYPE

RESISTORS

RES.

RES.

MULTIPLIER

CODE

TOL.

CODE

RATIO

TOL.

TCR

(ppm/°C)

TERM.

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

CL

A =

isolated

B =

bussed

03

04

05

06

07

08

09

10

11

12

First 4

digits are

significant

figures of

resistance

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1 %

C = 0.25 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

J = 5.0 %

K = 10.0 %

B = 0.1 %

F = 1.0 %

N = none

E = ± 25

C = ± 50

K = ± 100

M = ± 250

G = Au

A = Al

G = Au

N = none

H = class H

K = class K

WS =

waffle pack,

100 min.,

1 mult.

08

3

0

0

0

F

0

A

CL

FK

A

N

H

W

S