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NCC5003JBGLP 数据表(PDF) 1 Page - California Micro Devices Corp

部件名 NCC5003JBGLP
功能描述  BUSSED RESISTOR NETWORK
PDF  1 Pages
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制造商  CALMIRCO [California Micro Devices Corp]
网页  http://www.calmicro.com
标志 CALMIRCO - California Micro Devices Corp

NCC5003JBGLP 数据表(HTML) 1 Page - California Micro Devices Corp

  NCC5003JBGLP Datasheet HTML 1Page - California Micro Devices Corp  
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© 2000 California Micro Devices Corp. All rights reserved.
6/2/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
CALIFORNIA MICRO DEVICES
NCC
BUSSED RESISTOR NETWORK
California Micro Devices’ resistor arrays are the hybrid
equivalent to the bussed resistor networks available in
surface-mount packages. The resistors are spaced on
ten mil centers resulting in reduced real estate. These
C0970500
STANDARD NETWORK SCHEMATIC DIAGRAM
chips are manufactured using advanced thin film
processing techniques and are 100% electrically
tested and visually inspected.
R1
R4
R2
R5
R7
R3
R6
R8
60
90
N
O
I
T
A
N
G
I
S
E
D
R
E
B
M
U
N
T
R
A
P
C
C
N
3
0
0
5F
A
G
W
P
s
e
i
r
e
Se
u
l
a
Ve
c
n
a
r
e
l
o
TR
C
Ts
d
a
P
d
n
o
Bg
n
i
k
c
a
B
o
i
t
a
R
e
c
n
a
r
e
l
o
T
e
r
a
s
t
i
g
i
d
3
t
s
r
i
F%
5
.
0
±
=
Dm
p
p
0
0
1
±
=
r
e
t
t
e
L
o
Nd
l
o
G
=
Gd
l
o
G
=
W%
1
=
r
e
t
t
e
L
o
N
.
e
u
l
a
v
t
n
a
c
i
f
i
n
g
i
s%
1
±
=
Fm
p
p
0
5
±
=
Am
u
n
i
m
u
l
A
=
r
e
t
t
e
L
o
Nd
e
p
p
a
L
=
L%
5
.
0
=
P
-
s
e
r
p
e
r
t
i
g
i
d
t
s
a
L%
2
±
=
Gm
p
p
5
2
±
=
Br
e
h
ti
E
=
r
e
t
t
e
L
o
N
f
o
r
e
b
m
u
n
s
t
n
e
s%
5
±
=
J
s
e
t
a
c
i
d
n
i
R
.
s
o
r
e
z%
0
1
±
=
K
.
t
n
i
o
p
l
a
m
i
c
e
d%
0
2
±
=
M
S
N
O
I
T
A
C
I
F
I
C
E
P
S
L
A
C
I
R
T
C
E
L
E
r
e
t
e
m
a
r
a
P
s
n
o
i
t
i
d
n
o
C
t
s
e
T
R
C
TC
°
5
2
1
o
t
C
°
5
5
–C
/
m
p
p
0
0
1
±x
a
M
e
g
a
t
l
o
V
g
n
i
t
a
r
e
p
OC
°
5
2
1
o
t
C
°
5
5
–c
d
V
0
5x
a
M
)
r
o
t
s
i
s
e
r
r
e
p
(
g
n
i
t
a
R
r
e
w
o
P
)
C
°
0
5
1
@
0
o
t
y
l
r
a
e
n
il
e
t
a
r
e
D
(
C
°
0
7
@w
m
0
5x
a
M
k
c
o
h
S
l
a
m
r
e
h
TF
2
0
2
-
D
T
S
-
L
I
M
7
0
1
d
o
h
t
e
M@
%
5
2
.
0
±
∆Rx
a
M
e
r
u
s
o
p
x
E
e
r
u
t
a
r
e
p
m
e
T
h
g
i
Ht
n
e
i
b
m
A
C
°
0
5
1
@
s
r
H
0
0
1%
5
2
.
0
±
∆Rx
a
M
e
r
u
t
s
i
o
MF
2
0
2
-
D
T
S
-
L
I
M
6
0
1
d
o
h
t
e
M%
5
.
0
±
∆Rx
a
M
e
f
i
L
)
r
h
0
0
0
1
/
C
°
5
2
1
(
F
2
0
2
-
D
T
S
-
L
I
M
8
0
1
d
o
h
t
e
M%
5
.
0
±
∆Rx
a
M
e
s
i
o
NF
2
0
2
-
D
T
S
-
L
I
M
8
0
3
d
o
h
t
e
MB
d
5
3
–x
a
M
≥
k
0
5
2
Ω
B
d
0
3
–x
a
M
d
a
o
l
r
e
v
O
e
m
i
T
t
r
o
h
S1
0
4
3
8
-
R
-
L
I
M%
5
2
.
0x
a
M
e
c
n
a
t
s
i
s
e
R
n
o
i
t
a
l
u
s
n
IC
°
5
2
@0
1
x
1
2
1 Ω
.
n
i
M
S
N
O
I
T
A
C
I
F
I
C
E
P
S
L
A
C
I
N
A
H
C
E
M
e
t
a
r
t
s
b
u
Sk
c
i
h
t
s
li
m
2
±
0
1
n
o
c
il
i
S
r
e
y
a
L
n
o
i
t
a
l
o
s
In
i
m
,
k
c
i
h
t
Å
0
0
0
,
0
1
2
0
i
S
g
n
i
k
c
a
B)
l
a
n
o
i
t
p
o
d
l
o
g
(
d
e
p
p
a
L
n
o
i
t
a
z
il
a
t
e
Mn
i
m
,
k
c
i
h
t
Å
0
0
0
,
0
1
m
u
n
i
m
u
l
A
)
l
a
n
o
i
t
p
o
d
l
o
g
Å
0
0
0
,
5
1
(
n
o
i
t
a
v
i
s
s
a
Pe
d
i
r
t
i
N
n
o
c
il
i
S
S
E
U
L
A
V
0
0
1
m
o
r
f
s
r
o
t
s
i
s
e
r
8
Ω
K
0
0
5
o
t
Ω
G
N
I
G
A
K
C
A
P
.
d
r
a
d
n
a
t
s
s
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m
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x
a
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s
p
i
h
c
6
9
1
f
o
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y
a
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t
e
r
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u
q
s
h
c
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o
w
T
S
E
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.
r
e
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t
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f
y
r
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a
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e
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t
a
p
r
o
t
s
i
s
e
R
.
1
Formats
Die Size: 90±3 x 60±3 mils
Bonding Pads: 5x7 mils typical


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