196 HVC ENYCAP™

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Vishay BCcomponents

Revision: 09-Jun-2021

13

Document Number: 28409

For technical questions, contact: hybridstorage@vishay.com

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Table 6.1

Notes

(1) n... number of cells

(2) RI equals ESRAC or ESRDC

Table 6.2: Stacked Through Hole configuration (STH), Surface Mount Flat configuration (SMF), and Lay Flat

configuration with Connector

Notes

• Robustness - bending limited to ± 15°, force in direction of tab / pin, no twisting allowed

• Solder bath test: max. allowed case temperature during test is e.g. 85 °C or immersion of one (1) pad only

• Wave soldering allowed

(1) RI equals ESRAC or ESRDC

SOLDERING

As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering

connections. However, the maximum specified soldering time and case temperature should never be exceeded.

EVALUATION KIT

Evaluation kits are available under ordering code: MAL219699001E3. The engineering kit includes a charge and discharge demo

board with different 196 HVC capacitor samples.

For further details, please contact hybridstorage@vishay.com.

Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the

lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability.

TEST PROCEDURES AND REQUIREMENTS

NAME OF TEST

ENYCAP

TESTS

SUBCLAUSE

PROCEDURE

(quick reference)

REQUIREMENTS (2)

Damp heat, steady state

4.12

500 h at 55 °C; RH 90 % to 95 %; no voltage applied

ΔC/C: ± 30 %

RI

≤ 4 x spec. limit

IL

≤ 2 x spec. limit

Endurance

4.13.1

Tamb = 70 °C / 85 °C; rated voltage UR applied;

4.0 F, 15 F: 1000 h

90 F: 2000 h

ΔC/C: ± 30 %

RI

≤ 4 x spec. limit

IL

≤ 2 x spec. limit

Useful life

4.13.2

Tamb = 70 °C / 85 °C; rated voltage UR applied;

4.0 F, 15 F: 1000 h

90 F: 2000 h

ΔC/C: ± 30 %

RI

≤ 4 x spec. limit

IL

≤ 2 x spec. limit

Storage at upper category

temperature

4.17

Tamb = 70 °C / 85 °C; no voltage applied;

1000 h

ΔC/C: ± 30 %

RI

≤ 4 x spec. limit

IL

≤ 2 x spec. limit

Self discharge

4.1.5

24 h storage at room temperature after application

of UR for 1 h

Remaining voltage:

≥ (UR x 0.9)

Characteristics at high and

low temperature

4.19

Step 1: reference measurement at 20 °C of C, RI, and IL

Step 2: measurement at -20 °C

Step 3: measurement at +20 °C

Step 4: measurement at +70 °C

Step 5: measurement at +20 °C

ΔC/C: ± 30 % of +20 °C value

RI

≤ 5 x the +20 °C value

IL

≤ 4 x the +20 °C value

Surge voltage

4.15

Max. 30 s at room temperature

US = n (1) x 1.6 V

No change of parameter!

After surge voltage, discharge

product below rated voltage

TEST PROCEDURES AND REQUIREMENTS

NAME OF TEST

ENYCAP

TESTS

SUBCLAUSE

PROCEDURE

(quick reference)

REQUIREMENTS (1)

Robustness of terminations

4.4

Tensile strength; application of load force in pin / tab

direction for 10 s:

10 N: for product size Ø

≥ 8 mm

5 N: for product size Ø < 8 mm

No breaks

Resistance to soldering heat

4.5

260 °C; 5 s

ΔC/C: ± 10 %

RI and IL

≤ spec. limit

Solderability

4.6

Solder bath; 236 °C; 2 s; one pin immersed

≥ 75 % tinning

Vibration

4.8

10 Hz to 55 Hz; 1.5 mm; 3 directions;

2 h per direction

ΔC/C: ± 10 %

RI and IL

≤ spec. limit