| 数据搜索系统,热门电子元器件搜索 |
|
CPC5611 数据表(PDF) 18 Page - Clare, Inc. |
|
|
|||||||||||||||||||||||||||||
CPC5611 数据表(HTML) 18 Page - Clare, Inc. |
|
18 / 18 page ![]() 7.2 Tape and Reel Packaging Figure 19. Tape and Reel Dimensions 7.3 Soldering 7.3.1 Moisture Reflow Sensitivity Clare has characterized the moisture reflow sensitivity of LITELINK using IPC/JEDEC standard J-STD-020A. Moisture uptake from atmospheric humidity occurs by diffusion. During the solder reflow process, in which the component is attached to the PCB, the whole body of the component is exposed to high process tempera- tures. The combination of moisture uptake and high reflow soldering temperatures may lead to moisture induced delamination and cracking of the component. To prevent this, this component must be handled in accordance with IPC/JEDEC standard J-STD-020A per the labeled moisture sensitivity level (MSL), level 3. 7.3.2 Reflow Profile The maximum ramp rates, dwell times, and tempera- tures of the assembly reflow profile should not exceed those specified in IPC/JEDEC standard J-STD-020A, which were used to determine the moisture sensitivity level of this component. 7.4 Washing Clare does not recommend ultrasonic cleaning of this part. Dimensions mm (inches) 330.2 DIA. (13.00) Top Cover Tape Thickness .102 MAX. (.004) 12.090 (.476) Embossed Carrier Embossment 6.731 MAX. (.265) .406 MAX. (.016) Top Cover Tape 3.20 (.126) 2.70 (.106) 7.493 ± .102 (.295 ± .004) 1.753 ± .102 (.069 ± .004) 2.007 ± .102 (.079 ± .004) 1.498 ±.102 (.059 ± .004) 3.987 ± .102 (.157 ±.004) Feed Direction 11.989 ± .102 (.472 ± .004) 10.897 ± .025 (.429 ± .001) 1.549 ± .102 (.061 ± .004) 10.693 ± .025 (.421 ± .001) 16.002 ± .305 (.630 ± .012) .050R TYP. For additional information please visit www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC5610/CPC5611-R9.0 Copyright © 2002, Clare, Inc. All rights reserved. Printed in USA. 6/27/2002 |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |