152 CME

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Revision: 05-Nov-2019

4

Document Number: 28459

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ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS



ACCORDING TO JEDEC J-STD-020

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

• Temperature measuring point on top of the case and on terminals

• Max. 2 runs with pause of min. 30 min in between

REFLOW SOLDERING CONDITIONS for MAL215299xxxE3

PROFILE FEATURES

CASE CODE

1010

CASE CODE

1213 TO 1216

CASE CODE

1616 TO 1821

Max. time from 25 °C to TPeak

300 s

300 s

300 s

Max. ramp-up rate to 150 °C

3 K/s

3 K/s

3 K/s

Max. time from 150 °C to 200 °C (t1)

150 s

150 s

150 s

Max. time from 190 °C to 200 °C (t2)

110 s

110 s

110 s

Ramp up rate from 200 °C to TPeak

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

Max. time above TLiquidus (217 °C) (t3)

90 s

90 s

90 s

Max. time above 230 °C (t4)

70 s

65 s

60 s

Peak temperature TPeak

260 °C

250 °C

245 °C

Max. time above TPeak minus 5 °C

40 s

30 s

30 s

Ramp-down rate from TLiquidus

3 K/s to 6 K/s

3 K/s to 6 K/s

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4