181 CPL

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Vishay BCcomponents

Revision: 15-Jul-16

4

Document Number: 28417

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Table 3

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Note

• Temperature measuring point on top of the case and on terminals.

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

0606

1.9

3.5

1.6

0807

3.0

3.5

2.5

0812

3.0

3.5

2.5

1008

4.0

4.0

2.5

1013

4.0

4.0

2.5

REFLOW SOLDERING CONDITIONS for MAL2181xxxxxE3

PROFILE FEATURES

CASE CODE

0606 TO 1013

Max. time from 25 °C to TPeak

300 s

Max. ramp-up rate to 150 °C

3 K/s

Max. time from 150 °C to 200 °C (t1)

150 s

Max. time from 190 °C to 200 °C (t2)

110 s

Ramp up rate from 200 °C to TPeak

0.5 K/s to 3 K/s

Max. time above TLiquidus (217 °C) (t3)90 s

Max. time above 230 °C (t4)

70 s

Peak temperature TPeak

260 °C

Max. time above TPeak minus 5 °C

40 s

Ramp-down rate from TLiquidus

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4