LTC3306

15

Rev. 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

BOTTOM VIEW

(BALL SIDE UP)

6-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-6-19)

Dimensions shown in millimeters

A

B

C

0.660

0.600

0.540

0.390

0.360

0.330

0.270

0.240

0.210

1.07

1.03

0.99

1.68

1.64

1.60

1

2

0.360

0.320

0.280

1.00

REF

0.50

BSC

COPLANARITY

0.05

TOP VIEW

(BALL SIDE DOWN)

END VIEW

SEATING

PLANE

BALL A1

IDENTIFIER