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3
Package Dimensions, continued
Notes:
1. Dimensions in mm.
2. Tolerance
± 0.1 mm unless otherwise noted.
Device Selection Guide
Footprint
AS AlInGaP
AS AlInGaP
AS AlInGaP
TS AlInGaP
Package
(mm)[1,2]
Amber
Orange
Red
Red
Description
1.6 x 0.8 x 0.8
HSMA-C190
HSML-C190
HSMC-C190
HSMZ-C190
Untinted, Diffused
2.0 x 1.25 x 0.8
HSMA-C170
HSML-C170
HSMC-C170
HSMZ-C170
Untinted, Diffused
3.2 x 1.0 x 1.5
HSMA-C110
HSML-C110
HSMC-C110
HSMZ-C110
Untinted, Nondiffused
1.6 x 0.8 x 0.6
HSMA-C191
HSML-C191
HSMC-C191
Untinted, Diffused
3.2 x 1.6 x 1.1
HSMA-C150
HSML-C150
HSMC-C150
Untinted, Diffused
Absolute Maximum Ratings
TA = 25°C
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
Parameter
HSMC-C110/170/190/191/150
HSMZ-C110/170/190
Units
DC Forward Current[1,2]
25
25
mA
Power Dissipation
60
65
mW
Reverse Voltage (IR = 100 µA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
–30 to +85
–30 to +85
°C
Storage Temperature Range
–40 to +85
–40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
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