101SHS100AS1LE datasheet(5/34 Pages) EXXELIA

5 / 34 page

CERAMIC CAPACITORS

121

info@exxelia.com

www.exxelia.com

General characteristics

Page revised 06/20

III.1.2. Infrared Soldering

0°C

300°C

250°C

200°C

150°C

100°C

50°C

30s 60s 90s 120s 150s 180s 210s 240s 270s 300s 330s 360s

ca. 45s ... 90s

>220°C

220°C

Preheating

Ramp down

rate <6K/s

Ramp up

rate <3K/s

235°C

245°C

Lead free SnAgCu solders – Infrared Soldering

0°C

300°C

250°C

200°C

150°C

100°C

50°C

20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s

ca. 60s >180°C

215°C

Preheating

Ramp down

rate <6K/s

Ramp up

rate <3K/s

180°C

160°C

130°C

230°C

240°C

SnPb solders – Infrared Soldering

NB:

• these proﬁles are given for mid size components.

• continuous lines: typical process (terminal temperature).

• dotted lines: process limits, bottom process limit (terminal temperature),

upper process limit (top surface temperature).

III.1.3. Wave Soldering

0°C

300°C

250°C

200°C

150°C

100°C

50°C

20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s

ca. 3.5 K/s typical

ca. 2 K/s

ca. 5 K/s

Preheating

First wave

SnPb: 235°C - 260°C

SnAgCu: 250°C - 260°C

T<150K

Second wave

10s max., max. contact time 5s per wave

Cooling

120°C

130°C

SnAgCu and SnPb solders - Double Wave Soldering

NB: • continuous lines: typical process.

• dotted lines: process limits.

III.2. Moisture Sensitivity Classiﬁcation

Our standard lead-free terminations - S and C types - have been fully tested

and are compliant with the requirements mentioned in speciﬁcation JEDEC STD

020 (level 1: not moisture sensitive).

III.3. Whiskers Classiﬁcation

Our standard lead-free terminations - S and C types - have been fully tested

and are compliant with the requirements mentioned in speciﬁcation JEDEC

STD 201. Our terminations exhibit a matte ﬁnish and receive a special heat

treatment to relieve stress inside the tin.

III.4. Pad Dimensions

The metalized pads on the end user’s substrate must be properly designed.

Improper spacing or dimensioning of the pads may result in poor solder joints

or a tombstone effect. Pad designs are given below for the most common sizes

of multilayer ceramic capacitors for both wave and reﬂow soldering.

Case Size

SHL (0402)

0.70mm

0.90mm

0.40mm

2.20mm

CHA / SHA (0505)

1.80mm

1.00mm

0.80mm

2.80mm

SHS (0603)

1.00mm

1.10mm

0.60mm

2.80mm

SHF (0805)

1.50mm

1.30mm

0.60mm

3.20mm

CHB / SHB (1111)

3.00mm

1.00mm

1.90mm

3.90mm

CPX / CLX (2225)

6.90mm

1.00mm

5.00mm

7.00mm

CPE / CLE (4040)

10.20mm

1.10mm

8.30mm

10.50mm

NB: these dimensions are suggested for a reﬂow soldering process. If a wave

soldering process is used, the X dimension has to be increased by 0.50mm

(0.40mm for L and A case sizes), thus leading to an increase of 1.00mm to the

L dimension (0.80mm for L and A case sizes).

General Information

101SHS100AS1LE 数据表(PDF) 5 Page - Exxelia Group

101SHS100AS1LE 数据表(HTML) 5 Page - Exxelia Group

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

数据表下载

链接网址

101SHS100AS1LE 数据表(PDF) 5 Page - Exxelia Group

101SHS100AS1LE 数据表(HTML) 5 Page - Exxelia Group

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

数据表 下载

链接网址

数据表下载