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TLP3553AF 数据表(PDF) 10 Page - Toshiba Semiconductor |
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TLP3553AF 数据表(HTML) 10 Page - Toshiba Semiconductor |
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10 / 16 page ![]() TLP3553A,TLP3553AF 10 19. 19. 19. 19. Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Item Name TLP3553A(F TLP3553A(LF1,F TLP3553A(LF5,F TLP3553A(TP1,F TLP3553A(TP5,F TLP3553A(D4,F TLP3553A(D4LF1,F TLP3553A(D4LF5,F TLP3553A(D4TP1,F TLP3553A(D4TP5,F TLP3553AF(F TLP3553AF(LF4,F TLP3553AF(TP4,F TLP3553AF(D4,F TLP3553AF(D4LF4F TLP3553AF(D4TP4F Packaging (Note 1) TH LF1 LF5 LF1 LF5 TH LF1 LF5 LF1 LF5 TH, Wide forming LF4, Wide forming LF4, Wide forming TH, Wide forming LF4, Wide forming LF4, Wide forming VDE Option EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 Packing (MOQ) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount 2020-03-25 Rev.5.0 ©2017-2020 Toshiba Electronic Devices & Storage Corporation |
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