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Document Number: 28729

14

Revision: 24-Feb-04

PR01/02/03

Vishay BCcomponents

Power Metal Film Resistors

4.16

21 (U)

robustness of terminations:

4.16.2

21 (Ua1)

tensile all samples

load 10 N; 10 s

4.16.3

21 (Ub)

bending half number of samples

load 5 N; 4 × 90°

4.16.4

21 (Uc)

torsion other half of samples

3 × 360° in opposite directions

no damage ∆R/R max.: ± 0.5 % + 0.05 Ω

4.20

29 (Eb)

bump

3 × 1500 bumps in three directions; 40 g

no damage ∆R/R max.: ± 0.5 % + 0.05 Ω

4.22

6 (Fc)

vibration

frequency 10 to 500 Hz; displacement 1.5 mm

or

acceleration 10 g; three directions; total

6 hours (3 × 2 hours)

no damage

∆R/R max.: ± 0.5 % + 0.05 Ω

4.19

14 (Na)

rapid change of

temperature

30 minutes at LCT and

30 minutes at UCT; 5 cycles

no visual damage

PR01: ∆R/R max.: ± 1 % + 0.05 Ω

PR02: ∆R/R max.: ± 1 % + 0.05 Ω

PR03: ∆R/R max.: ± 2 % + 0.05 Ω

4.23

climatic sequence:

4.23.3

30 (Db)

damp heat

4.23.6

30 (Db)

damp heat

(accelerated)

remaining cycles

6 days; 55 °C; 95 to 98 % RH

∆R/R max.: ± 3 % + 0.1 Ω

4.24.2

3 (Ca)

damp heat

(steady state) (IEC)

56 days; 40 °C; 90 to 95% RH; loaded with

∆R/R max.: ± 3 % + 0.1 Ω

4.25.1

endurance (at 70 °C)

1.5 hours on and 0.5 hours off

∆R/R max.: ± 5 % + 0.1 Ω

4.8.4.2

temperature coefficient

at 20/LCT/20 °C and 20/UCT/20 °C

≤± 250

OTHER TESTS IN ACCORDANCE WITH IEC 60115 CLAUSES AND IEC 60068 TEST METHOD

4.17

20 (Tb)

solderability

(after ageing)

8 hours steam or 16 hours 155 °C; leads

immersed 6 mm for 2 ± 0.5 s in a solder bath

at 235 ± 5 °C

good tinning (≥ 95 % covered);

no damage

4.6.1.1

insulation resistance

maximum voltage (DC) after 1 minute; metal

block method

IEC 60115-1,Jan. ’87

pulse load

see Pulse Load Capabilities graphs

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS