VLMS150., VLMO1500, VLMY150., VLMG1500, VLMTG150., VLMB150.

www.vishay.com

Vishay Semiconductors

Rev. 1.5, 19-Mar-2021

10

Document Number: 82554

For technical questions, contact: LED@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

VLMx150x-Series

SOLDERING PROFILE

Fig. 20 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020C)

BAR CODE PRODUCT LABEL (Example only)

A. 2D barcode

B. Part No: Vishay part number

C. QTY: quantity

D. SelCode: selection bin code

E. Country of origin

F. PTC: product plant code

G. Termination finish

H. Region code

I. Serial#: serial number

K. Batch Number: year, week, country code, plant code

L. SL: storage location

M. Environmental

Symbols:

RoHS,

lead

(Pb)-free,

halogen-free

N. Lot numbers

Not indicated tolerances ± 0.1

Drawing-No.: 6.541-5096.01-4

Issue: 2; 10.03.21

Recommended solder

pad footprint

0.6

1.55

1

0.325

0.325

Cathode

Technical drawings

according to DIN

specification

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

255

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. Ramp Up 3 °C/s

max. Ramp Down 6 °C/s

255 °C

IR Reflow Soldering Profile for lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2a

max. 2 cycles allowed

A

B

D

C

F

G

I

N

K

L

E

H

M