VLMW15..

www.vishay.com

Vishay Semiconductors

Rev. 1.6, 19-Mar-2021

6

Document Number: 82522

For technical questions, contact: LED@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

SOLDERING PROFILE

Fig. 8 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020C)

Not indicated tolerances ± 0.1

Drawing-No.: 6.541-5096.01-4

Issue: 2; 10.03.21

Recommended solder

pad footprint

0.6

1.55

1

0.325

0.325

Cathode

Technical drawings

according to DIN

specification

19470-6

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

255

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. Ramp Up 3 °C/s

max. Ramp Down 6 °C/s

255 °C

IR Reflow Soldering Profile for lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2a

max. 2 cycles allowed