VLMB41..

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Vishay Semiconductors

Rev. 1.9, 05-Jul-2022

5

Document Number: 81641

For technical questions, contact: LED@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

METHOD OF TAPING / POLARITY AND TAPE AND REEL

SMD LED (VLM.3..., VLM.4...-SERIES)

Vishay’s LEDs in SMD packages are available in an

antistatic 8 mm blister tape (in accordance with DIN IEC 40

(CO) 564) for automatic component insertion. The blister

tape is a plastic strip with impressed component cavities,

covered by a top tape.

TAPING OF VLM.3..., VLM.4...

Fig. 8 - Tape Dimensions in mm for PLCC-2

REEL PACKAGE DIMENSION IN MILLIMETERS

FOR SMD LEDS, TAPE OPTION GS08

(= 1500 PCS.)

Fig. 9 - Reel Dimensions - GS08

REEL PACKAGE DIMENSION IN MILLIMETERS

FOR SMD LEDS, TAPE OPTION GS18

(= 8000 PCS.) PREFERRED

Fig. 10 - Reel Dimensions - GS18

SOLDERING PROFILE

Fig. 11 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020)

Fig. 12 - Double Wave Soldering of Opto Devices (all Packages)

Adhesive tape

Component cavity

Blister tape

94 8670

1.85

1.65

4.0

3.6

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668

180

178

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Identification

Label:

Vishay

type

group

tape code

production

code

quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

type

group

tape code

production

code

quantity

IR Reflow Soldering Profile for Lead (Pb)-Free Soldering

Preconditioning according to JEDEC level 2a

19885

240 °C

Max. 260 °C

217 °C

255 °C

10

0

100

200

300

0

50

100

150

200

300

Time (s)

50

150

250

250

245 °C

Max. 100 s

Max. 30 s

Max. 120 s

Max. ramp down 6 °C/s

Max. ramp up 3 °C/s

Max. 2 cycles allowed

948626-1

10

100

1000

10000

0

100

200

300

0

50

100

150

200

250

TTW Soldering (according to CECC00802)

Time (s)

50

150

250

2 K/s

Second

wave

First wave

5 s

Full line: typical

Dotted lines:

process limits

Lead temperature

235 °C to

260 °C

100 °C to

130 °C

ca. 200 K/s

Forced cooling

ca. 5 K/s

ca. 2 K/s