TSOP372.., TSOP374..

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Vishay Semiconductors

Rev. 2.2, 30-Mar-2021

6

Document Number: 82599

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 168 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Exercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled off

Notes

(1) Optically effective area

(2) Pins connected internally. It is not necessary to connect externally

Drawing-No.: 6.550-5315.01-4

Issue: 2; 12.02.14

Not indicated tolerances ± 0.1

technical drawings

according to DIN

specifications

Proposed pad layout from

component side

(dim. for reference only)

(3.95)

(0.35)

(3)

(4 x)

0.75± 0.05

4 x 0.75 = 3

0.35± 0.05

(8 x)

1.5

3

(0.3)

0.475

Pinning from topview

1

2

3

4

5

8

7

6

Pin 1 identification

(2)

(2)

(2)

(2)

3.95

(3.4)

marking area

Pin 1 Identification

(1)