TSOP573..H, TSOP575..H

www.vishay.com

Vishay Semiconductors

Datasheet Values Refer to PCN-OPT-1224-2022

Rev. 2.3, 30-Aug-2022

7

Document Number: 82652

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

4.3 ± 0.2

Pinning from Topview

0.75 ± 0.05

4 x 0.75 = 3

0.35 ± 0.05

(8 x)

1.5

3

(0.3)

(3.25)

Proposed pad layout from

component side

(dim. for reference only)

(4.3)

(0.35)

4 x 0.75 = 3

technical drawings

according to DIN

specifications

All dimensions in mm

Not indicated tolerances ± 0.1

Drawing-No.: 6.550-5316.01-4

Issue: 2; 12.02.14

(3 x)

(0.45)

1

2

3

4

5

8

7

6

Marking area

Pin 1 identification

0.475

Allowed offset

outer edge of shield

to solder pads of

molded device

± 0.1 mm

optically effective area

(1)

(1)

(2) Pins connected internally.

It is not necessary to connect

externally.

(2)

(2)

(2)

(2)