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Z00607MA2BL2 数据表(PDF) 3 Page - STMicroelectronics |
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Z00607MA2BL2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() DocID6629 Rev 9 3/8 Z00607 Characteristics 8 Table 4. Thermal resistances Symbol Parameter Value Unit Rth(j-t) Junction to tab (AC) SOT-223 25 °C/W Rth(j-I) Junction to lead (AC) TO-92 60 Rth(j-a) Junction to ambient S(1) = 5 cm² SOT-223 60 °C/W TO-92 150 1. S = Copper surface under tab. Figure 1. Maximum power dissipation versus RMS on-state current (full cycle) Figure 2. Relative variation of gate trigger, holding and latching current versus junction temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 P(W) I (A) T(RMS) -40 -20 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 I, I , I [T ] / GTHL j I , I , I [T =25°C] GTHL j T (°C) j IGT IH &IL Typical values Figure 3. Surge peak on-state current versus number of cycles Figure 4. Non-repetitive surge peak on-state current and corresponding value of I2t 1 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 One cycle t=20ms I (A) TSM Number of cycles Non repetitive T initial = 25°C j Repetitive T = 25°C amb 0.01 0.10 1.00 10.00 0.1 1.0 10.0 100.0 200.0 t (ms) p I (A), I t (A s) TSM 22 It 2 dI/dt limitation: 20A/µs T initial = 25°C j ITSM Sinusoidal pulse with width tp < 10 ms |
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