date 08/05/2022

page 1 of 3

MODEL: HSB02-101007 | DESCRIPTION: HEAT SINK

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FEATURES

• BGA design

• small footprint

• aluminum alloy

• black anodized finish

MODEL

thermal resistance1

power

dissipation1

@ 75°C ΔT, nat

conv (°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT, nat

conv

(W)

HSB02-101007

37.90

41.9

16.50

12.30

1.98

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

0

20

40

60

80

100

120

140

012345

Without Airflow

200 LFM

400 LFM

Heat Dissipated (W)

Heatsink Temperature Rise Above

Ambient (

ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

41.9

16.5

12.3

2

75.8

32.3

23.9

3

105.6

47.8

35.2

4

132.1

62.9

47.3

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

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