OPA310 datasheet(10/60 Pages) TI

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7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–) Supply voltage, VS = (V+) – (V–)

Signal input pins

Common-mode voltage (2) (3)

– 0.5

6.0

Differential voltage (2) (3)

±6.0

Current (3)

–10

Output short-circuit (4)

Continuous

Operating ambient temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Input pins can swing beyond (V+) as long as they stay with in 6.0 V. No diode structure from input pins to (V+).

(3)

Input pins are diode-clamped to (V–). Input signals that 0.3 V below (V–) must be current-limited to 10 mA or less.

(4)

Short-circuit to ground, one amplifier per package.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±4000

Charged-device model (CDM), per JEDEC specification JS-002 (2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

1.5

5.5

Input voltage range

– 0.1

5.6

Specified temperature

–40

125

°C

7.4 Thermal Information for Single Channel

THERMAL METRIC (1)

OPA310

OPA310S

UNIT

DBV

(SOT-23)

DCK

(SC70)

DPW (2)

(X2SON)

DRL (2)

(X2SON)

DBV

(SOT-23)

DCK

(SC70)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

211.5

214.6

TBD

190.7

195.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

109.4

110.0

TBD

110.5

122.9

°C/W

RθJB

Junction-to-board thermal resistance

77.8

60.7

TBD

70.8

55.5

°C/W

ψJT

Junction-to-top characterization parameter

45.2

32.1

TBD

47.4

38.3

°C/W

ψJB

Junction-to-board characterization parameter

77.5

60.4

TBD

70.5

55.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

TBD

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is on preview.

OPA310, OPA2310, OPA4310

SBOSAA1E – APRIL 2022 – REVISED DECEMBER 2022

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