TS4962 datasheet(21/22 Pages) STMICROELECTRONICS

21 / 22 page

Package Mechanical Data

TS4962

21/22

4 Package Mechanical Data

4.1 Pin-out and markings for 9-bump flip-chip

4.2 Mechanical data for 9-bump flip-chip

Figure 61. Pin-out for

9-bump flip-chip (top view)

Figure 62. Marking for

9-bump flip-chip (top view)

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

■ Bumps are underneath

■ Bump diameter = 300µm

A62

YWW

A62

YWW

■

ST Logo

■

Part Number: A62

■

Three digits Datecode: YWW

■

E symbol for lead-free only

■

The dot is for marking pin A1

Marking: A62

■ Die size: 1.6mm x 1.6mm ±30µm

■ Die height (including bumps): 600µm

■ Bump diameter: 315µm ±50µm

■ Bump diameter before Reflew: 300µm ±10µm

■ Bump height: 250µm ±40µm

■ Die Height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ *Back Coating layer Height: 100µm ±10µm

■ Coplanarity: 60µm max

* Optional

1.60 mm

0.5mm

∅ 0.25mm

1.60 mm

0.5mm

∅ 0.25mm

600µm

100µm

600µm

100µm

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