The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks

of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information

will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.

STATS ChipPAC reserves the right to change the information at any time and without notice.

©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.

May 2006

Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823

Global Offices

USA 510-979-8000

JAPAN 81-3-5789-5850

CHINA 86-21-5976-5858

MALAYSIA 603-4257-6222

KOREA 82-31-639-8911

TAIWAN 886-3-593-6565

UK 44-1483-413-700

NETHERLANDS 31-38-333-2023

SPECIFICATIONS

Die Thickness

150-350

µm

Gold Wire

20-33µm (0.8-1.3mils) diameter

Lead finish

Matte Tin, preplated Ni/Pd/Au or Sn/Pb

Marking

Laser

Packing Options

Tape & reel, tube, JEDEC tray

RELIABILITY

Moisture Sensitivity Level

JEDEC MSL 3/2/1

(depending on package)

Temperature Cycling

–65°C/150°C, 1000 cycles

High Temp Storage

150°C, 1000 hrs

Pressure Cooker Test

121°C, 100% RH, 2 atm, 168 hrs

Temperature/Humidity Test

85°C/85% RH, 1000 hrs

THERMAL PERFORMANCE,

θja (°C/W)

Package

Body Size

Pad Size

Die Size

*Thermal Performance

Thermal Vias

(mm)

(mm)

(mm)

θja(°C/W)

(on test board)

48L UQFN

7 x 7 x 0.50

5.1 x 5.1

2.26 x 2.26

26.3

2 5

64L QFN

9 x 9 x 0.85

7.3 x 7.3

4.52 x 4.52

19.2

3 6

76L QFN-dr

8 x 8 x 0.85

5.28 x 5.28

4.52 x 4.52

26.6

1 6

Notes: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.

CROSS-SECTIONS

ELECTRICAL PERFORMANCE

Package

Body Size (mm)

Frequency

Length

Inductance (nH)

Capacitance (pF)

48L UQFN

7 x 7 x 0.50

100 MHz

Self (short)

0.88

0.191

Mutual

0.20

0.032

Self (long)

0.98

0.223

Mutual

0.27

0.064

76L QFN-dr

8 x 8 x 0.85

100 MHz

Self (short)

1.33

0.180

Mutual

0.45

0.080

Self (long)

1.68

0.270

Mutual

0.53

0.110

Note: Results are simulated values per JEDEC EIA/JEP123 standards.

PACKAGE CONFIGURATIONS

Lead Count

2 x 2

0.65/0.50

4/8

2 x 3

0.50

6/8

3 x 3

0.80/0.65/0.50/0.40

4/8/12/16/20

4 x 4

0.80/0.65/0.50/0.40

12/14/16/20/24/28

5 x 5

0.80/0.65/0.50/0.40

14/16/20/28/32/40

6 x 5

0.80/0.65/0.50

18/20/22/32

6 x 6

0.80/0.65/0.50/0.40

20/24/28/32/36/38/40/48

7 x 7

0.80/0.65/0.50/0.40

28/32/36/40/44/48/56

8 x 8

0.80/0.65/0.50/0.40

28/32/36/40/44/48/52/56/64

9 x 9

0.65/0.50/0.40

44/48/56/60/64/72

10 x 10

0.50/0.40

64/68/72/88

10 x 10

0.50 dual row

124

12 x 12

0.50 dual row

156

QFN

Quad Flat No-Lead Package

QFNs-dr

QFNs

QFNp

QFNp-dr