Package mechanical data

ST33TPM12LPC

6/13

DocID022203 Rev 4

3

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

3.1

28-pin thin shrink small outline package (TSSOP) with 4.4-

mm body width

Dimensional features of the TSSOP28 package: Body width 4.4 mm. Pitch 0.65 mm.

Unless otherwise specified, general tolerance is ± 0.1 mm.

Figure 4. 28-lead thin shrink small outline package outline

Table 2. 28-lead thin shrink small outline package mechanical data

Symbol

millimeters

inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.20

0.047

A1

0.05

0.15

0.002

0.006

A2

0.80

1.00

1.05

0.031

0.040

0.041

b

0.19

0.30

0.007

0.012

c

0.09

0.20

0.004

0.008

D

9.60

9.70

9.80

0.378

0.382

0.386

E

6.20

6.40

6.60

0.244

0.252

0.260

E1

4.30

4.40

4.50

0.170

0.173

0.177