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2139 数据表(PDF) 2 Page - Molex Electronics Ltd.

部件名 2139
功能描述  KK® 396 Reflow Process Compatible (RPC) Compatible (RPC)
PDF  2 Pages
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制造商  MOLEX [Molex Electronics Ltd.]
网页  http://www.molex.com
标志 MOLEX - Molex Electronics Ltd.

2139 数据表(HTML) 2 Page - Molex Electronics Ltd.

  2139 Datasheet HTML 1Page - Molex Electronics Ltd. 2139 Datasheet HTML 2Page - Molex Electronics Ltd.  
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KK® 396
Reflow Process
Compatible (RPC)
Connector System
www.molex.com/link/kk396.html
©2014 Molex
Order No. 987650-9461 Rev. 1
Printed in USA/KC/2014.05
Reflow Process Compatible Connectors
Series No.
Circuits
Pitch
Plating
Packaging
Vertical
Right-Angle
171813
171814
2 to 12
3.96mm
Tin (Sn)
Bag or
Tape-and-Reel
171813
171814
15 μm Gold (Au)
Standard PCB Headers
Series No.
Configuration
Pitch
Application
Friction Lock
PC Peg
Breakaway
41791
Vertical
3.96mm
Wire-to-Board,
Board-to-Board,
Power
Yes
No
No
41792
Right-Angle
41671
Vertical
Yes
41672
Right-Angle
42491
Vertical
Yes
No
42492
Right-Angle
41661
Vertical
No
No
Yes
41662
Right-Angle
41771
Vertical
No
41772
Right-Angle
Ordering Information
Standard PCB Receptacles
Series No.
Pitch
Application
Material
Configurations
41815
3.96mm
Board-to-Board
UL 94V-0
Top Entry, Through Hole,
Right-Angle
2145
UL 94V-2
Standard Crimp Terminals
Series No.
Pitch
Application
Base Material
2478
3.96mm
Power
Phosphor Bronze
2578
Brass
8818
6838
Phosphor Bronze
45570
Copper Alloy
Standard Crimp Housings
Series No.
Pitch
Application
Friction Lock
2139
3.96mm
Wire-to-Board, Power
Yes
3069
6442
No
41695
Yes
Reference Information
Packaging: Bag; tape-and-reel
UL File No.: E29179
CSA File No.: LR19980
Mates With:
any KK® 3.96mm housing or PCB
receptacle
Designed In: Millimeters
RoHS: Yes
Low Halogen: Yes
Glow Wire Compliant: Yes
Specifications
Electrical
Voltage (max.): 600V
Current (max.): 13.0A
Contact Resistance (max.): 10mΩ
Dielectric Withstanding Voltage:
500V AC (RMS)
Insulation Resistance (min.):
1000MΩ
Mechanical
Contact Insertion Force: 17.8N
Contact Retention to Housing: 36.8N
Mating Force: 10.7N per circuit
Unmating Force: 3.4N per circuit
Durability (min.): 25 cycles
Physical
Housing: High-temperature Nylon
Contact: Brass
Plating:
Contact Area — Matte Tin (Sn) or
Select Gold (Au)
Solder Tail Area — Matte Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 1.60mm
Operating Temperature:
Brass: -40 to +80°C
Phosphor Bronze: -40 to +105°C



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