STM32F103C8 datasheet(50/116 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F103x8, STM32F103xB

50/116

DS5319 Rev 18

5.3.6

External clock source characteristics

High-speed external user clock generated from an external source

The characteristics given in Table 20 result from tests performed using a high-speed

external clock source, and under ambient temperature and supply voltage conditions

summarized in Table 9.

APB2 (up to 72 MHz)

APB2-Bridge

3.75

GPIOA

6.67

GPIOB

6.53

GPIOC

6.53

GPIOD

6.53

GPIOE

6.39

SPI1

4.72

USART1

11.94

TIM1

23.33

ADC1(2)

17.50

ADC2(2)

16.07

1. The BusMatrix is automatically active when at least one master peripheral is ON (CPU or DMA).

2. Specific conditions for measuring ADC current consumption: fHCLK = 56 MHz, fAPB1 = fHCLK / 2, 

fAPB2 = fHCLK, fADCCLK = fAPB2 / 4, When ADON bit in the ADCx_CR2 register is set to 1, a current

consumption of analog part equal to 0.65 mA must be added for each ADC.

Table 19. Peripheral current consumption (continued)

Peripherals

µA/MHz

Table 20. High-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHSE_ext User external clock source frequency(1)

MHz

VHSEH

OSC_IN input pin high level voltage

0.7VDD

-VDD

VHSEL

OSC_IN input pin low level voltage

VSS

-0.3VDD

tw(HSE)

OSC_IN high or low time(1)

1. Specified by design, not tested in production.

tr(HSE)

tf(HSE)

OSC_IN rise or fall time(1)

Cin(HSE) OSC_IN input capacitance(1)

DuCy(HSE) Duty cycle

OSC_IN Input leakage current

VSS VIN VDD

±1

µA

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