REV. E

–14–

REF19x Series

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

REF19x features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

WAFER TEST LIMITS

Parameter

Symbol

Condition

Limit

Unit

INITIAL ACCURACY

REF191

2.043/2.053

V

REF192

2.495/2.505

V

REF193

2.990/3.010

V

REF194

4.495/4.505

V

REF195

4.995/5.005

V

REF196

3.290/3.310

V

REF198

4.091/4.101

V

LINE REGULATION

15

ppm/V

LOAD REGULATION

15

ppm/mA

DROPOUT VOLTAGE

1.25

V

1.55

V

SLEEP MODE INPUT

Logic Input High

2.4

V

Logic Input Low

0.8

V

SUPPLY CURRENT

No Load

45

µA

Sleep Mode

No Load

15

µA

For proper operation, a 1

µF capacitor is required between the output pins and the GND pin of the REF19x. Electrical tests and wafer probe to the limits shown.

Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications

based on dice lot qualifications through sample lot assembly and testing.

DICE CHARACTERISTICS

OUTPUT

6

OUTPUT

6

2

V

3

SLEEP

4

GND

REF19x Die Size 0.041”

0.057”, 2,337 Square Mils

Substrate Is Connected to V+, Number of Transistors:

Bipolar 25, MOSFET4. Process: CBCMOS1

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V

Output to GND Short-Circuit Duration . . . . . . . . . Indefinite

Storage Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Operating Temperature Range

REF19x . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Junction Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300

°C

Package Type

JA

2

JC

Unit

8-Lead PDIP (P)

103

43

°C/W

8-Lead SOIC (S)

158

43

°C/W

8-Lead TSSOP (RU)

240

43

°C/W

NOTES

otherwise noted.

2

θ

θ

PDIP, and

θ