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BCP55_BCX55_BC55PA

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Product data sheet

Rev. 8 — 24 October 2011

6 of 22

Nexperia

BCP55; BCX55; BC55PA

60 V, 1 A NPN medium power transistors

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

[4]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.

[5]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

BCP55

[1] --192

K/W

[2] --125

K/W

[3] --93

K/W

BCX55

[1] --250

K/W

[2] --132

K/W

[3] --93

K/W

BC55PA

[1] --298

K/W

[2] --151

K/W

[3] --114

K/W

[4] --154

K/W

[5] --76

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

BCP55

-

-

16

K/W

BCX55

-

-

16

K/W

BC55PA

--20

K/W