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ST25TB02K 数据表(PDF) 3 Page - STMicroelectronics |
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ST25TB02K 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 47 page ![]() Die floor plan and physical options related to the die assembly are described in Figure 2. Figure 2. Die floor plan and assembly options For the option 1 of the die assembly, the CTUN (referenced in Table 2) can increase from 0.5pF to 1pF. The option 2 of the die assembly is showing a tripod which can be used for physical stability, having no impact on CTUN parameter. ST25TB02K Description DS11469 - Rev 7 page 3/47 |
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