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ST33TPHF2XI2C 数据表(PDF) 3 Page - STMicroelectronics |
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ST33TPHF2XI2C 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 30 page ![]() 1 Description The STSAFE-TPM (Trusted Platform Module) family offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices. The STSAFE-TPM products are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions. These products are all Common Criteria (EAL4+) and FIPS certified. The ST33TPHF2XI2C is based on a smartcard-class secure MCU. The ST33TPHF2XI2C offers an I²C interface compliant with the TCG PC Client TPM Profile specifications. The ST33TPHF2XI2C product offers resilience services during the TPM firmware upgrade process, and self- recovery of TPM firmware and critical data upon failure detection. The ST33TPHF2XI2C operates in the –25 to +85 °C commercial temperature range at 1.8 V, or in the –40 °C to 105 °C extended temperature range at 3.3 V. The device is offered in VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark. ST33TPHF2XI2C Description DS14167 - Rev 1 page 3/30 |
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