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ST33TPHF2XSPI 数据表(PDF) 24 Page - STMicroelectronics |
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ST33TPHF2XSPI 数据表(HTML) 24 Page - STMicroelectronics |
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24 / 35 page ![]() 8 Package marking information The figure below illustrates the typical marking of the VFQFPN32 device package. Figure 18. VFQFPN32 device package marking area A B C D E F G I J H K A: Marking area B: Assembly plant C: BE sequence D: Diffusion plant E: Country of origin F: Assembly year G: Assembly week H: Second-level interconnect (JESD97) I: ST logo J: Marking area - 2 digits K: Dot For both packages, the 6-digit ‘A’ marking area is equal to "PXYZZZ", with: • Y = Hardware revision • ZZZ = Product identifier ST33TPHF2XSPI Package marking information DS14186 - Rev 1 page 24/35 |
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