PEMB1_PUMB1

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 3 — 28 November 2011

9 of 14

NXP Semiconductors

PEMB1; PUMB1

PNP/PNP resistor-equipped transistors; R1 = 22 k

, R2 = 22 k

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

[2]

T1: normal taping

[3]

T2: reverse taping

11. Soldering

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type

number

Package Description

Packing quantity

3000

4000

8000

10000

PEMB1

SOT666

2 mm pitch, 8 mm tape and reel

-

-

-315

-

4 mm pitch, 8 mm tape and reel

-

-115

-

-

PUMB1

SOT363

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-

-

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-

-

-165

Reflow soldering is the only recommended soldering method.

Fig 12. Reflow soldering footprint PEMB1 (SOT666)

solder lands

placement area

occupied area

solder paste

sot666_fr

2.75

2.45

2.1

1.6

0.4

(6

×)

0.55

(2

×)

0.25

(2

×)

0.6

(2

×)

0.65

(2

×)

0.3

(2

×)

0.325

(4

×)

0.45

(4

×)

0.5

(4

×)

0.375

(4

×)

1.7

2

1.7

1.075

0.538

Dimensions in mm