AD7693

Preliminary Technical Data

Rev. PrB | Page 24 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-BA

0.23

0.08

0.80

0.60

0.40

8°

0°

0.15

0.05

0.33

0.17

0.95

0.85

0.75

SEATING

PLANE

1.10 MAX

10

6

5

1

0.50 BSC

PIN 1

COPLANARITY

0.10

3.10

3.00

2.90

3.10

3.00

2.90

5.15

4.90

4.65

Figure 47.10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

3.00

BSC SQ

INDEX

ARE A

TOP VIEW

1.50

BCS SQ

EXPOSED

PAD

(BOT TOM VIEW)

1.74

1.64

1.49

2.48

2.38

2.23

1

6

10

0.50

BSC

0.50

0.40

0.30

5

PIN 1

INDICATOR

0.80

0.75

0.70

0.05 MAX

0.02 NOM

SEATING

PLANE

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.55 TYP

SIDE VIEW

PADDLE CONNECTED TO GND.

THIS CONNECTION IS NOT

REQUIRED TO MEET THE

ELECTRICAL PERFORMANCES

QFN Package in development. Contact sales for samples and availability.

Figure 48. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-10-9)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Ordering Quantity

Package Description

Package Option

Branding

EVAL-AD7693CB

Evaluation Board

1

EVAL-CONTROL BRD2

Controller Board

2

EVAL-CONTROL BRD3

Controller Board

2

©2006 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

PR05793-9/06(PrB)