SC14WAMDECT datasheet(35/37 Pages) RENESAS

35 / 37 page

Datasheet

Revision 3.1

05-Jan-2022

CFR0011-120-00-FM Rev 5

35 of 36

SC14WAMDECT SF

Wireless Audio Module

FINAL

11.0 Revision history

19-Nov-2013

v1.0:

• Initial version

27-Nov-2013

v1.1:

• Antenna diversity description updated in sections

4.4 and 5.6.2.

14-Jan-2014

v1.11:

• Updated connection diagram, Pin description,

Speaker configuration (section 3.3).

• Added section 6.7 (Audio performance).

14-Jan-2014

v1.12:

• Corrected Pin description.

• Updated Table 5 and Battery low/empty voltage in

section 5.1.

• Updated section 10.3.

11-Feb-2014

v1.13:

• Corrected section 10.3.

18-Mar-2014

v1.20:

• Corrected system diagram.

• Corrected pin description for pin #26.

• Description for pin RED_LED2 updated.

• Added "Example application diagrams" on page

27.

27-Mar-2014

v1.21:

• Feature list updated.

29-Aug-2014

v1.22:

• Text changed for J-DECT certify as “Pre-certified”.

• Explanation for the Pin description changed.

• Volume control section updated.

• Low battery indication added in section 5.5.

• Added explanation for RF1 in section 5.6.

• KDECT explanation added.

• PTT changed to AIPP and AOFP.

• Accessory Input (AIPP) and output (AOPP) sec-

tion added (section 5.1.5).

• Wire registration added to section 3.4 and section

4.5.

• Usage Guidelines (section 5.0) updated.

10-Oct-2014

v1.23:

• Updated latency value for TG mode.

• Added low power mode.

23-Jul-2015

v3.0 (Final):

• Product status: Production.

• Korean DECT mode removed: not supported.

• Section 1.0:

• Connection diagram updated (Figure 1).

• PP and FP removed from pin names.

• Unused pins changed to NC.

• Pins AIPP and AOFP renamed to ACC_IN and

ACC_OUT.

• Pin 11 (GND) renamed to VREFm.

• Added pins ACCESS_0 to ACCESS_5 (pins

65, 15, 69 to 66).

• Removed battery management section (charging

is not supported).

• Supply currents moved from section 6.8 to new

section 6.4.

• Updated supply currents (Table 12 and Table 13).

• Example application diagrams added for PA and

TG mode.

• Section 10.0:

• Reflow soldering profile updated (Figure 17).

• Soldering stencil thickness changed to

0.130 mm.

• Package outline drawing updated (Figure 21).

• Back page:

• Status definition table updated.

• Contact information updated.

• Template updated to latest version.

SC14WAMDECT 数据表(PDF) 35 Page - Renesas Technology Corp

SC14WAMDECT 数据表(HTML) 35 Page - Renesas Technology Corp

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

数据表下载