HCS08MS

FN3047 Rev 1.00

Page 6 of 8

August 1995

Intersil Space Level Product Flow - ‘MS’

Wafer Lot Acceptance (All Lots) Method 5007

(Includes SEM)

GAMMA Radiation Verification (Each Wafer) Method 1019,

4 Samples/Wafer, 0 Rejects

100% Nondestructive Bond Pull, Method 2023

Sample - Wire Bond Pull Monitor, Method 2011

Sample - Die Shear Monitor, Method 2019 or 2027

100% Internal Visual Inspection, Method 2010, Condition A

100% Temperature Cycle, Method 1010, Condition C,

10 Cycles

100% Constant Acceleration, Method 2001, Condition per

Method 5004

100% PIND, Method 2020, Condition A

100% External Visual

100% Serialization

100% Initial Electrical Test (T0)

100% Static Burn-In 1, Condition A or B, 24 hrs. min.,

+125oC min., Method 1015

100% Interim Electrical Test 1 (T1)

100% Delta Calculation (T0-T1)

100% Static Burn-In 2, Condition A or B, 24 hrs. min.,

+125oC min., Method 1015

100% Interim Electrical Test 2 (T2)

100% Delta Calculation (T0-T2)

100% PDA 1, Method 5004 (Notes 1 and 2)

100% Dynamic Burn-In, Condition D, 240 hrs., +125oC or

Equivalent, Method 1015

100% Interim Electrical Test 3 (T3)

100% Delta Calculation (T0-T3)

100% PDA 2, Method 5004 (Note 2)

100% Final Electrical Test

100% Fine/Gross Leak, Method 1014

100% Radiographic, Method 2012 (Note 3)

100% External Visual, Method 2009

Sample - Group A, Method 5005 (Note 4)

100% Data Package Generation (Note 5)

NOTES:

3. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.

4. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the

failures from subgroup 7.

5. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.

6. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.

7. Data Package Contents:

• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number,

Quantity).

• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.

• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test

equipment, etc. Radiation Read and Record data on file at Intersil.

• X-Ray report and film. Includes penetrometer measurements.

• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).

• Lot Serial Number Sheet (Good units serial number and lot number).

• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.

• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed

by an authorized Quality Representative.