HCS151MS

FN3077 Rev 1.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

84 x 84 mils

2.13 x 2.13mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCS151MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS151 is TA14467A.

I2

I3

VCC

I1 (3)

I0 (4)

Y (5)

Y (6)

(8)

(9)

(11) S0

(12) I7

(13) I6

(14) I5

(2)

(1)

(16)

GND

S2

(10) S1

(7)

I4

(15)

E