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HCS244DMSR 数据表(PDF) 10 Page - Renesas Technology Corp |
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HCS244DMSR 数据表(HTML) 10 Page - Renesas Technology Corp |
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10 / 10 page ![]() HCS244MS FN2132 Rev 2.00 Page 10 of 10 September 1995 Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: Al/Sil Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS244MS (18) Y0 1 (17) A3 2 (16) Y1 1 (15) A2 2 (14) Y2 1 (13) (12) A1 2 Y3 1 (11) A0 2 (10) GND (9) Y0 2 (8) A3 1 VCC (20) OE 2 (19) OE (1) A0 1 (2) Y3 2 (3) A1 1 (4) Y2 2 (5) A2 1 (6) Y1 2 (7) |
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