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BAS83 数据表(PDF) 2 Page - NXP Semiconductors |
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BAS83 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 8 page ![]() 1998 Jun 24 2 Philips Semiconductors Product specification Schottky barrier diodes BAS81; BAS82; BAS83 FEATURES • Low forward voltage • High breakdown voltage • Guard ring protected • Hermetically-sealed small SMD package • Low diode capacitance. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Blocking diodes. DESCRIPTION Planar Schottky barrier diode with an integrated protection ring against static discharges. This surface mounted diode is encapsulated in a hermetically sealed SOD80C glass SMD package with tin-plated metal discs at each end. It is suitable for “automatic placement” and as such it can withstand immersion soldering. Fig.1 Simplified outline (SOD80C), pin configuration and symbol. handbook, halfpage MAM190 ka Cathode indicated by a grey band. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage BAS81 − 40 V BAS82 − 50 V BAS83 − 60 V IF continuous forward current − 30 mA IFRM repetitive peak forward current tp ≤ 1s; δ≤ 0.5 − 150 mA IFSM non-repetitive peak forward current tp =1s − 500 mA Tstg storage temperature −65 +150 °C Tj junction temperature − 125 °C |
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