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PBSS4032PD 数据表(PDF) 4 Page - Nexperia B.V. All rights reserved |
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PBSS4032PD 数据表(HTML) 4 Page - Nexperia B.V. All rights reserved |
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4 / 15 page ![]() PBSS4032PD_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 3 of 14 NXP Semiconductors PBSS4032PD 30 V, 2.7 A PNP low VCEsat (BISS) transistor [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. Ptot total power dissipation Tamb ≤ 25 °C [1] - 480 mW [2] - 750 mW [3] -1 W Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tamb (°C) −75 175 125 25 75 −25 006aab931 400 800 1200 Ptot (mW) 0 (1) (3) (2) |
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