AD8342

Preliminary Technical Data

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm x 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions in millimeters

ORDERING GUIDE

Models

Temperature

Package

Package Description

Package

Outline

Branding

Transport Media,

Quanity

AD8342ACPZ-REEL71

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package

[LFCSP_VQ]

CP-16-3

Q01

1,500, Reel

AD8342ACPZ-R21

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package

[LFCSP_VQ]

CP-16-3

Q01

250, Reel

AD8342ACPZ-WP1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package

[LFCSP_VQ]

CP-16-3

Q01

50, Waffle Pack

AD8342-EVAL

Evaluation Board

1

© 2005 Analog Devices, Inc. All rights reserved. Trademarks and regis-

tered trademarks are the property of their respective owners.

D05352–0–4/05(0)