Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

MF-SM013/250 - Telecom PTC Resettable Fuses

Additional Features

Product Dimensions

Model

A

Max.

B

Max.

C

Max.

D

Nom.

E

Nom.

G

Nom.

H

Nom.

I

Nom.

MF-SM013/250-2

9.4

(0.370)

3.7

(0.146)

7.4

(0.291)

0.3

(0.012)

3.8

(0.149)

9.7

(0.383)

4.6

(0.18)

1.8

(0.071)

MF-SM013/250-A-2

9.4

(0.370)

3.7

(0.146)

7.4

(0.291)

0.3

(0.012)

3.8

(0.149)

9.7

(0.383)

4.6

(0.18)

1.8

(0.071)

MF-SM013/250-B-2

9.4

(0.370)

3.7

(0.146)

7.4

(0.291)

0.3

(0.012)

3.8

(0.149)

9.7

(0.383)

4.6

(0.18)

1.8

(0.071)

MF-SM013/250-C-2

9.4

(0.370)

3.7

(0.146)

7.4

(0.291)

0.3

(0.012)

3.8

(0.149)

9.7

(0.383)

4.6

(0.18)

1.8

(0.071)

Packaging:

TAPE & REEL: 1500 pcs. per reel

DIMENSIONS:

MM

(INCHES)

A

C

D

Side View

B

E

End View

H

I

G

Recommended Pad Layout

I

H

Terminal material:

Tin-plated brass

Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

•

Recommended reflow methods: IR, vapor phase oven, hot air oven.

•

Devices are not designed to be wave soldered to the bottom side of the

board.

•

Gluing the devices is not recommended.

•

Recommended maximum paste thickness is 0.25 mm (.010 inch).

•

Devices can be cleaned using standard industry methods and solvents.

Note:

•

If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

•

A device should not be reworked.

Storage Recommendations

should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage

recommendations are exceeded. Devices stored in this manner have an indefinite shelf life.