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ADP1611ARMZ-R7 数据表(PDF) 16 Page - Analog Devices |
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ADP1611ARMZ-R7 数据表(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP1611 Rev. 0 | Page 16 of 20 LAYOUT PROCEDURE To achieve high efficiency, good regulation, and stability, a well- designed printed circuit board layout is required. Where possible, use the sample application board layout as a model. Follow these guidelines when designing printed circuit boards (see Figure 1): • Keep the low ESR input capacitor, CIN, close to IN and GND. • Keep the high current path from CIN through the inductor, L1, to SW and PGND as short as possible. • Keep the high current path from CIN through L1, the rectifier, D1, and the output capacitor, COUT, as short as possible. • Keep high current traces as short and as wide as possible. • Place the feedback resistors as close to FB as possible to prevent noise pickup. • Place the compensation components as close as possible to COMP. • Avoid routing high impedance traces near any node connected to SW or near the inductor to prevent radiated noise injection. Figure 31. Sample Application Board (Bottom Layer) |
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