DBLC08CI

Document number: DS43654 Rev. 1 - 2

2 of 5

www.diodes.com

January 2022

© Diodes Incorporated

DBLC08CI

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Conditions

Peak Pulse Power Dissipation

PPP

350

W

8/20

μs, Per Figure 3

Peak Pulse Current

IPP

14

A

8/20

μs, Per Figure 3

ESD Protection

– Contact Discharge

VESD_Contact

±27

kV

Standard IEC 61000-4-2

ESD Protection

– Air Discharge

VESD_Air

±30

kV

Standard IEC 61000-4-2

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Package Power Dissipation (Note 5)

PD

250

mW



Thermal Resistance, Junction to Ambient (Note 5)

RƟJA

500

C/W

Operating Temperature Range

TJ

-55 to +125

C

Storage Temperature Range

TSTG

-55 to +150

C

Soldering Temperature, t max =10s

TL

260

C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Working Voltage

VRWM

—

—

8

V

—

Reverse Current (Note 5)

IR

—

—

2

uA



VR = VRWM = 8V

Reverse Breakdown Voltage

VBR

8.5

—

—

V

IR = 1mA

Reverse Clamping Voltage

VCL

—

—

13.4

V

IPP = 1A, tp = 8/20μs

—

—

25

IPP = 14A, tp = 8/20μs

Capacitance

CT

—

0.6

0.7

pF

VR = 0V, f = 1MHz

Notes:

5. Device mounted on FR-

4 PCB pad layout (2oz copper) as shown in Diodes Incorporated’s package outline PDFs, which can be found on our website at

http://www.diodes.com/package-outlines.html.

6. Short duration pulse test used to minimize self-heating effect.

10

100

1000

10000

1

10

100

1000

Figure 1, ESD pulse waveform according to IEC 61000-4-2

Figure 2, power dissipation versus pulse time

Pulse Times,(us)

Tj = 25°C, tp = 8/20us

exponentially decay waveform