the junction temperature. Use the junction-to-board characterization parameter (ψJB) with the PCB surface

temperature 1 mm from the device package (TB) to calculate the junction temperature.

TJ = TT + ψJT × PD

(4)

where:

• PD is the dissipated power

• TT is the temperature at the center-top of the device package

TJ = TB + ψJB × PD

(5)

where:

• TB is the PCB surface temperature measured 1 mm from the device package and centered on the package

edge

For detailed information on the thermal metrics and how to use them, see the Semiconductor and IC Package

Thermal Metrics application note.

LP2985

SLVS522Q – JULY 2004 – REVISED DECEMBER 2022

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