S3170 – 2.5 Gbps Transimpedance Amplifier

AMCC Confidential and Proprietary

3

Revision A – August 12, 2004

Data Sheet

1.

The coordinates represent the position of the center of the pad in µm, with respect to the lower left corner of the die.

2.

Note: I = Input pin, O = Output pin, S = Supply pin

Table 1. S3170 Pad Assignment and Description

Pin Name

I/O

Pad #

Description

VCC

S

8

9

10

11

12

[868.9, 1051.4]

[669.6, 1051.4]

[470.8, 1051.4]

[271.8, 1051.4]

[90.8, 892.5]

+3.3 V Power supply.

GND

S

1

2

3

4

[273, 91.4]

[472, 91.4]

[670.8, 91.4]

[870.1, 91.4]

Ground.

RBYPASS

I

13

15

[100.925, 702.425]

[90.9, 293.3]

Bypass connection for cathode of photodiode.

IIN

I

14

[97.575, 473.975]

PIN diode input.

FILT

I

7

[1052.3. 777]

Filter capacitor input. A capacitor to ground can be

added at this pad to reduce the low frequency -3 dB

cutoff. (See Design Procedures).

OUTN

O

6

[1049.275, 567.475]

Negative transimpedance amplifier output.

OUTP

O

5

[1049.275, 375.225]

Positive transimpedance amplifier output.