Version 05.01.03

Mobile

RF: LPC MID

lightweight, small in size, and surface

mounted with a low profile of 3,47

mm. This new generation of mobile phone

connectors uses the latest plated plastics

technology, which permits the outer shape to

be modified easily, allowing for a more

flexible design.

Applications:

Performance Specifications

Connector Durability

12,000 mating cycles min.

Corrosive Atmosphere

In accordance with IEC 68-2-60: SO

Frequency Range

0 to 2 GHz

Humidity

Operable in 90% relative humidity, temp. 40°C (104°F)

Impedance

50 Ω nominal

Mating Force of Ground

4 N and < 7 N

Mating Force of Signal

> 0.20 N after 2 soldering processes and 10,000 mating cycles

Mounting

Surface Mount

Offset Mating

0.9 mm

Operating Temperature

–40°C and 85°C (–40°F to 185°F)

Packaging

Tape & Reel, 2000 pieces per reel

Salt Spray

In accordance with IEC 68-2-11, Method Ka

Shock

In accordance with IEC 68-2-27: 30

6 directions - No discontinuity

Solder System

Infrared and hot air reflow

Vibration

In accordance with IEC 68-2-36: 1.92 10

– No discontinuity

A

Att 990000 M

MH

Hzz

A

Att 11880000 M

MH

Hzz

A

Att 22000000 M

MH

Hzz

Voltage Standing Wave Ratio (VSWR)

<1.2:1

<1.3:2

<1.3:1

After 500 mating cycles

<1.3:1

<1.4:1

<1.4:1

Insertion loss on customer PCB (mismatch losses

Included) through PCB connector (unmated)

<0.1 dB

<0.1 dB

<0.1 dB

Isolation between switching contacts

>30 dB

>25 dB

>25 dB

Materials and Finishes

Description

Material

Finish

Shell

LCP

Gold

Insulator

LCP

Color: Natural

Moving Contact

Beryllium Copper

Gold

Fixed Contact

Brass

Gold

Please contact your local Cannon representative: www.ittcannon.com/support/ContactUs

M-13

Dimensions are shown in mm (inch)

Dimensions subject to change

www.ittcannon.com

Product Features

For more information: www.ittcannon.com/cat267