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DMN3012LEG 数据表(PDF) 2 Page - Diodes Incorporated |
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DMN3012LEG 数据表(HTML) 2 Page - Diodes Incorporated |
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2 / 10 page ![]() DMN3012LEG Document number: DS41633 Rev. 2 - 2 2 of 10 www.diodes.com March 2019 © Diodes Incorporated DMN3012LEG Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Q1 Q2 Unit Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±10 V Continuous Drain Current @ VGS = 5V TC = +25C ID 20 A TC = +70C 16 TA = +25C ID 10 A TA = +70C 8 Pulsed Drain Current (10 μs Pulse, Duty Cycle = 1%) IDM 70 100 A Continuous Source-Drain Diode Current (Note 5) IS 2.7 3.2 A Avalanche Current (Note 6) L = 0.1mH IAS 34 50 A Avalanche Energy (Note 6) L = 0.1mH EAS 58 125 mJ ESD Capability(Note 9) HBM 300 V CDM 1000 V Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Total Power Dissipation TC = +25°C PD 2.2 W TC = +70°C 1.4 Thermal Resistance, Junction to Ambient (Note 5) Steady State RJA 58 °C/W t<10s 36 Thermal Resistance, Junction to Case (Note 5) RJC 9.5 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics Q1 (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 30 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current IDSS — — 1 μA VDS = 20V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±10V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) 1 — 2.1 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — 10.5 12 m Ω VGS = 5V, ID = 15A Diode Forward Voltage VSD — — 1.0 V VGS = 0V, IS = 15A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 650 850 pF VDS = 15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 314 410 Reverse Transfer Capacitance Crss — 12 16 Gate Resistance Rg — 1.63 3.3 Ω VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge (VGS = 4.5V) Qg — 4.7 6.1 nC VDS = 15V, ID = 15A Total Gate Charge at VTH Qg(TH) — 0.91 — Gate-Source Charge Qgs — 1.6 — Gate-Drain Charge Qgd — 0.9 — Turn-On Delay Time tD(ON) — 5.1 7.7 ns VDD = 15V, VGS = 4.5V, ID = 15A, Rg = 2Ω Turn-On Rise Time tR — 2.7 — Turn-Off Delay Time tD(OFF) — 6.4 9.6 Turn-Off Fall Time tF — 2.3 — Reverse Recovery Time tRR — 24.5 — ns IF = 15A, di/dt = 300A/μs Reverse Recovery Charge QRR — 8.3 — nC Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 6. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. 9. Based on characterization data only. Not subject to production testing. |
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