ADL5391

Rev. 0 | Page 15 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 26. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering Quantity

ADL5391ACPZ-R21

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-3

250

ADL5391ACPZ-R71

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-3

1,500

ADL5391ACPZ-WP1

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-3

50

ADL5391-EVALZ1

Evaluation Board

1