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DSC-2661/19

© 2017 Integrated Device Technology, Inc. All rights reserved. Product subject to change without notice.

NOVEMBER 2017

CMOS ASYNCHRONOUS FIFO

2,048 x 9, 4,096 x 9

8,192 x 9, 16,384 x 9

32,768 x 9 and 65,536 x 9

IDT7203

IDT7204

IDT7205

IDT7206

IDT7207

IDT7208

IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.

COMMERCIAL,MILITARYANDINDUSTRIALTEMPERATURERANGES

LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018

FEATURES:

••••• First-In/First-Out Dual-Port memory

••••• 2,048 x 9 organization (IDT7203)

••••• 4,096 x 9 organization (IDT7204)

••••• 8,192 x 9 organization (IDT7205)

••••• 16,384 x 9 organization (IDT7206)

••••• 32,768 x 9 organization (IDT7207)

••••• 65,636 x 9 organization (IDT7208)

••••• High-speed: 12ns access time

••••• Low power consumption

— Active: 660mW (max.)

— Power-down: 44mW (max.)

••••• Asynchronous and simultaneous read and write

••••• Fully expandable in both word depth and width

••••• 720x family is pin and functionally compatible from 256 x 9 to 64k x 9

••••• Status Flags: Empty, Half-Full, Full

••••• Retransmit capability

••••• High-performance CMOS technology

••••• Military product compliant to MIL-STD-883, Class B

••••• Standard Military Drawing for #5962-88669 (IDT7203), 5962-89567

(IDT7203), and 5962-89568 (IDT7204) are listed on this function

DESCRIPTION:

TheIDT7203/7204/7205/7206/7207/7208aredual-portmemorybuffers

withinternalpointersthatloadandemptydataonafirst-in/first-outbasis. The

deviceusesFullandEmptyflagstopreventdataoverflowandunderflowand

expansionlogictoallowforunlimitedexpansioncapabilityinbothwordsizeand

depth.

DataistoggledinandoutofthedevicethroughtheuseoftheWrite(W)and

Read (R) pins.

The device's 9-bit width provides a bit for a control or parity at the user’s

option. ItalsofeaturesaRetransmit(RT)capabilitythatallowsthereadpointer

to be reset to its initial position when RT is pulsed LOW. A Half-Full Flag is

available in the single device and width expansion modes.

These FIFOs are fabricated using high-speed CMOS technology. They

aredesignedforapplicationsrequiringasynchronousandsimultaneousread/

writesinmultiprocessing,ratebufferingandotherapplications.

MilitarygradeproductismanufacturedincompliancewithMIL-STD-883,

ClassB.

FUNCTIONAL BLOCK DIAGRAM

• Industrial temperature range (–40

°C to +85°C) is available

(plastic packages only)

W

WRITE

CONTROL

READ

CONTROL

R

FLAG

LOGIC

EXPANSION

LOGIC

XI

WRITE

POINTER

RAM ARRAY

2,048 x 9

4,096 x 9

8,192 x 9

16,384 x 9

32,768 x 9

65,536 x 9

READ

POINTER

DATA INPUTS

RESET

LOGIC

THREE-

STATE

BUFFERS

DATA OUTPUTS

EF

FF

XO/HF

RS

FL/RT

0

(D -D8)

0

(Q -Q 8)

2661 drw01

••••• Green parts available, see ordering information