MPC5553 datasheet(8/60 Pages) FREESCALE

8 / 60 page

MPC5553 Microcontroller Data Sheet, Rev. 0

Preliminary—Subject to Change Without Notice

Electrical Characteristics

Freescale Semiconductor

to the printed circuit board. This model can be used for either hand estimations or for a computational fluid

dynamics (CFD) thermal model.

To determine the junction temperature of the device in the application after prototypes are available, the

Thermal Characterization Parameter (

ΨJT) can be used to determine the junction temperature with a

measurement of the temperature at the top center of the package case using the following equation:

TJ = TT + (ΨJT × PD)

where:

TT = thermocouple temperature on top of the package (oC)

ΨJT = thermal characterization parameter (oC/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T

thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so

that the thermocouple junction rests on the package. A small amount of epoxy is placed over the

thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire

is placed flat against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

References:

Semiconductor Equipment and Materials International

805 East Middlefield Rd

Mountain View, CA 94043

(415) 964-5111

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at

800-854-7179 or 303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

•

1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

•

2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.

•

3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego,

1999, pp. 212–220.

3.3

Package

The MPC5553 is available in packaged form. Package options are listed in Section 2, “Ordering

Information.”

Refer to Section 4, “Mechanicals,” for pinouts and package drawings.

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